HDPlex H3


13.2 x 12.6 x 4.5 inches (LxWxH)

Supports Micro ATX Motherboards and 65 W Processors

Up to Four 2.5″ Solid State Drives

Up to 3 PCIe Expansion Cards Supported

1 in stock

SKU: 1697 Category: Tags: , , ,


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The HDPlex H3 is the best performing fanless heatsink-case for Micro ATX motherboards, able to cool a wide variety of processors. The case measures only 13.2 x 12.6 x 4.5 inches (LxWxH). The H3 case is a heatsink that directs heat from the internal parts to the outside of the case through eight heatpipes. It is compatible with Micro ATX motherboards and processors with TDPs of up to 65W. There is space for up to 4 2.5″ storage drives. Due to its size, it is not compatible with graphics cards. It is compatible with up to 2 low-profile PCIe expansion cards, and 1 full-height PCIe expansion card with a PCIe riser. The case has a 3.5 mm audio jack, a power on/off button, and a USB 3.1 Type C Port on the left side. It is compatible with external power supplies.

Additional information

Weight 22 lbs
Dimensions 16 × 16 × 15 in